EP3C25F324C8N vs EP3C25F324I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C8N disebabkan oleh Intel dan EP3C25F324I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C8N | EP3C25F324I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Kemasan | 324-BGA (FineLine) | 324-ball FBGA (Fine-Pitch BGA) |
| Supply Voltage - Core | 1.2 V | — |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | 0 C to +85 C (commercial, suffix C) | -40C to +100C (Industrial) |
| Speed Grade | 8 | 7 (slower speed grade, lower power) |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Aras MSL | — | 3 (168 hours) |