EP3C25F324C8N vs EP3C25F324I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C8N sa pamamagitan ng Intel at EP3C25F324I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C8N | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Packhaging | 324-BGA (FineLine) | 324-ball FBGA (Fine-Pitch BGA) |
| Supply Voltage - Core | 1.2 V | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0 C to +85 C (commercial, suffix C) | -40C to +100C (Industrial) |
| Speed Grade | 8 | 7 (slower speed grade, lower power) |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 (168 hours) |