EP3C25F324I7 vs EP3C25F324C6N Perbandingan
Perbandingan bersamaan detil EP3C25F324I7 dari Intel dan EP3C25F324C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324I7 | EP3C25F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | TSMC 65 nm low-power (LP) |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Suhu Hubung Kerja | -40 °C to +100 °C (industrial) | — |
| Paket | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FBGA-324), fine-pitch |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Status RoHS | Compliant | — |
| Family | — | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Speed Grade | — | C6 (commercial) |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |