EP3C25F324I7 vs EP3C25F324C6N 比較
詳細並排比較 EP3C25F324I7 由 Intel 與 EP3C25F324C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C25F324I7 | EP3C25F324C6N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | TSMC 65 nm low-power (LP) |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| 工作接面溫度 | -40 °C to +100 °C (industrial) | — |
| 封裝 | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FBGA-324), fine-pitch |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS 狀態 | Compliant | — |
| Family | — | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| Speed Grade | — | C6 (commercial) |
| 工作溫度 | — | 0C to +85C (commercial) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |