EP3C55F484C7N vs EP3C55U484C6N Perbandingan
Perbandingan bersamaan detil EP3C55F484C7N dari Intel dan EP3C55U484C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F484C7N | EP3C55U484C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory (bits) | 2,396,160 | — |
| Maximum User I/O | 327 | — |
| Number of LABs/CLBs | 3,491 | — |
| Embedded Multipliers (18x18) | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Paket | 484-FBGA (FineLine BGA) | 484-FBGA |
| Speed Grade | 7 | — |
| Suhu Kerja | 0C to 85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Process Technology | 60 nm TSMC low-power | 65 nm |
| Configuration Modes | JTAG, AS, AP, PS | — |
| Encryption | AES-256 | — |
| Tegangan Pemuat | 1.2 V core (VCCINT) | — |
| Status RoHS | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Tipe Mounting | — | Surface Mount |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Tahanan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |