EP3C55F780C6 vs EP3C55F780C6N Perbandingan
Perbandingan bersamaan detil EP3C55F780C6 dari Intel dan EP3C55F780C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55F780C6 | EP3C55F780C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Paket | 780-ball FBGA | 780-ball FBGA (F780) |
| Speed Grade | -6 (C6) | C6 |
| Suhu Kerja | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Process Technology | 65 nm low power | 65 nm low-power CMOS |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone III FPGA |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Embedded 18x18 Multipliers | — | 312 |
| Maximum User I/O | — | 377 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |