EP3C55F780C6 vs EP3C55F780C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C6 sa pamamagitan ng Intel at EP3C55F780C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C6 | EP3C55F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Packhaging | 780-ball FBGA | 780-ball FBGA (F780) |
| Speed Grade | -6 (C6) | C6 |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Process Technology | 65 nm low power | 65 nm low-power CMOS |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone III FPGA |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Embedded 18x18 Multipliers | — | 312 |
| Maximum User I/O | — | 377 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |