EP3C55U484C7 vs EP3C55U484C7N Perbandingan
Perbandingan bersamaan detil EP3C55U484C7 dari Intel dan EP3C55U484C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C55U484C7 | EP3C55U484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Paket | 484-ball UBGA (Ultra-FineLine BGA) | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| Suhu Kerja | 0C to +85C (Commercial) | 0 °C to +85 °C (commercial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 (2.4 Mbit) |
| Maximum User I/Os | — | 327 |
| I/O Banks | — | 8 |
| DSP Blocks (18 x 18 Multipliers) | — | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) |
| PLLs | — | 4 |
| M9K Memory Blocks | — | 260 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Configuration Modes | — | AS, PS, FPP, JTAG |