EP3C55U484C7 vs EP3C55U484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55U484C7 disebabkan oleh Intel dan EP3C55U484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55U484C7 | EP3C55U484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Kemasan | 484-ball UBGA (Ultra-FineLine BGA) | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0 °C to +85 °C (commercial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 (2.4 Mbit) |
| Maximum User I/Os | — | 327 |
| I/O Banks | — | 8 |
| DSP Blocks (18 x 18 Multipliers) | — | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) |
| PLLs | — | 4 |
| M9K Memory Blocks | — | 260 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Configuration Modes | — | AS, PS, FPP, JTAG |