EP3C80F780C6N vs EP3C55F780C6N Perbandingan
Perbandingan bersamaan detil EP3C80F780C6N dari Intel dan EP3C55F780C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C80F780C6N | EP3C55F780C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LE) | 81,264 | 55,856 |
| Embedded Memory Bits | 2,810,880 bits | — |
| Embedded Memory (Mbits) | 4 Mbits | — |
| Embedded 18x18 Multipliers | 281 | 312 |
| PLLs | 4 | 4 |
| Maximum User I/O | 429 | 377 |
| I/O Banks | 8 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Operating Frequency | 500 MHz | — |
| Paket | 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (F780) |
| Operating Temperature (Commercial) | 0 C to +85 C | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, per AmpHeo listing) | — |
| Family | — | Cyclone III FPGA |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Speed Grade | — | C6 |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Status RoHS | — | Compliant |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |