EP3C80F780C6N vs EP3C55F780C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C80F780C6N disebabkan oleh Intel dan EP3C55F780C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C80F780C6N | EP3C55F780C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LE) | 81,264 | 55,856 |
| Embedded Memory Bits | 2,810,880 bits | — |
| Embedded Memory (Mbits) | 4 Mbits | — |
| Embedded 18x18 Multipliers | 281 | 312 |
| PLLs | 4 | 4 |
| Maximum User I/O | 429 | 377 |
| I/O Banks | 8 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Operating Frequency | 500 MHz | — |
| Kemasan | 780-ball FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (F780) |
| Operating Temperature (Commercial) | 0 C to +85 C | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, per AmpHeo listing) | — |
| Family | — | Cyclone III FPGA |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Speed Grade | — | C6 |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Status RoHS | — | Compliant |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |