EP3CLS70F780C7 vs EP3CLS70F780I7N Perbandingan
Perbandingan bersamaan detil EP3CLS70F780C7 dari Intel dan EP3CLS70F780I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3CLS70F780C7 | EP3CLS70F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory Bits | 3,068,928 | — |
| User I/O Pins | 413 | — |
| Total I/O Pins | 780 (FBGA package) | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Operating Frequency (max) | 437.5 MHz | — |
| Paket | 780-ball FBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed Grade | C7 (commercial, low power) | — |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage | — |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) | — |
| PLLs | Yes (per PLL specification) | — |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| Tegangan Pemuat | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |