EP3CLS70F780C7 vs EP3CLS70F780I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F780C7 disebabkan oleh Intel dan EP3CLS70F780I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3CLS70F780C7 | EP3CLS70F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory Bits | 3,068,928 | — |
| User I/O Pins | 413 | — |
| Total I/O Pins | 780 (FBGA package) | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Operating Frequency (max) | 437.5 MHz | — |
| Kemasan | 780-ball FBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | C7 (commercial, low power) | — |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage | — |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) | — |
| PLLs | Yes (per PLL specification) | — |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| Tegangan Pemberi Arus | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |