EP3CLS70F780C7 vs EP3CLS70F780I7N 比較
詳細並排比較 EP3CLS70F780C7 由 Intel 與 EP3CLS70F780I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3CLS70F780C7 | EP3CLS70F780I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory Bits | 3,068,928 | — |
| User I/O Pins | 413 | — |
| Total I/O Pins | 780 (FBGA package) | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Operating Frequency (max) | 437.5 MHz | — |
| 封裝 | 780-ball FBGA | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Speed Grade | C7 (commercial, low power) | — |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage | — |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) | — |
| PLLs | Yes (per PLL specification) | — |
| RoHS 狀態 | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Maximum User I/O | — | 413 pins |
| 供應電壓 | — | 1.2 V |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| 工作溫度 | — | [DATA_NEEDED: operating temperature] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |