EP3CLS70F780I7N vs EP3CLS70F780C8 Perbandingan

Perbandingan bersamaan detil EP3CLS70F780I7N dari Intel dan EP3CLS70F780C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3CLS70F780I7N EP3CLS70F780C8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Type Field Programmable Gate Array (FPGA) —
Series Cyclone III LS —
Logic Elements 70,208 —
Embedded Memory 3,068,928 bits —
Maximum User I/O 413 pins —
Tegangan Pemuat 1.2 V —
Temperature Grade Industrial —
Package Type BGA —
Package Pin Count 780 balls —
Package Shape Square —
Terminal Form Ball —
Configuration Technology SRAM-based FPGA —
Configuration Method [DATA_NEEDED: configuration method] —
Suhu Kerja [DATA_NEEDED: operating temperature] —
Tipe Mounting Surface Mount Surface Mount (BGA)
Status RoHS unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Family — Cyclone III LS
Logic Elements (LE) — 70,208
Logic Array Blocks (LAB) — 4,463
Embedded Memory Bits — 3,068,928 bit
Embedded Memory (M9K blocks) — 305
Embedded 18x18 Multipliers — 244
Maximum User I/O Pins — 413
Maximum Operating Frequency — 402 MHz
Process Technology — 65 nm TSMC low-power CMOS
Core Supply Voltage — 1.2 V
Paket — 780-ball FineLine BGA (FBGA-780)
Suhu Hubung Kerja — 0 °C to +85 °C (commercial)
PLLs — 4 general-purpose PLLs
Global Clock Networks — 20
Security Features — AES bitstream encryption, JTAG tamper protection
Configuration Scheme — Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP)

Spek dan Sumber

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