EP3CLS70F780I7N vs EP3CLS70F780C8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F780I7N disebabkan oleh Intel dan EP3CLS70F780C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS70F780I7N EP3CLS70F780C8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Type Field Programmable Gate Array (FPGA) —
Series Cyclone III LS —
Logic Elements 70,208 —
Embedded Memory 3,068,928 bits —
Maximum User I/O 413 pins —
Tegangan Pemberi Arus 1.2 V —
Temperature Grade Industrial —
Package Type BGA —
Package Pin Count 780 balls —
Package Shape Square —
Terminal Form Ball —
Configuration Technology SRAM-based FPGA —
Configuration Method [DATA_NEEDED: configuration method] —
Suhu Operasi [DATA_NEEDED: operating temperature] —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Family — Cyclone III LS
Logic Elements (LE) — 70,208
Logic Array Blocks (LAB) — 4,463
Embedded Memory Bits — 3,068,928 bit
Embedded Memory (M9K blocks) — 305
Embedded 18x18 Multipliers — 244
Maximum User I/O Pins — 413
Maximum Operating Frequency — 402 MHz
Process Technology — 65 nm TSMC low-power CMOS
Core Supply Voltage — 1.2 V
Kemasan — 780-ball FineLine BGA (FBGA-780)
Suhu Hubungan Operasi — 0 °C to +85 °C (commercial)
PLLs — 4 general-purpose PLLs
Global Clock Networks — 20
Security Features — AES bitstream encryption, JTAG tamper protection
Configuration Scheme — Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP)

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