EP3CLS70F780I7N vs EP3CLS70F780C8 比較

詳細並排比較 EP3CLS70F780I7N 由 Intel 與 EP3CLS70F780C8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS70F780I7N EP3CLS70F780C8
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type Field Programmable Gate Array (FPGA) —
Series Cyclone III LS —
Logic Elements 70,208 —
Embedded Memory 3,068,928 bits —
Maximum User I/O 413 pins —
供應電壓 1.2 V —
Temperature Grade Industrial —
Package Type BGA —
Package Pin Count 780 balls —
Package Shape Square —
Terminal Form Ball —
Configuration Technology SRAM-based FPGA —
Configuration Method [DATA_NEEDED: configuration method] —
工作溫度 [DATA_NEEDED: operating temperature] —
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Family — Cyclone III LS
Logic Elements (LE) — 70,208
Logic Array Blocks (LAB) — 4,463
Embedded Memory Bits — 3,068,928 bit
Embedded Memory (M9K blocks) — 305
Embedded 18x18 Multipliers — 244
Maximum User I/O Pins — 413
Maximum Operating Frequency — 402 MHz
Process Technology — 65 nm TSMC low-power CMOS
Core Supply Voltage — 1.2 V
封裝 — 780-ball FineLine BGA (FBGA-780)
工作接面溫度 — 0 °C to +85 °C (commercial)
PLLs — 4 general-purpose PLLs
Global Clock Networks — 20
Security Features — AES bitstream encryption, JTAG tamper protection
Configuration Scheme — Active serial (AS), passive serial (PS), JTAG, Fast Passive Parallel (FPP)

資料表與資源

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