EP3SE110F780C3N vs EP3SE110F780I3 Perbandingan

Perbandingan bersamaan detil EP3SE110F780C3N dari Intel dan EP3SE110F780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE110F780C3N EP3SE110F780I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Stratix III E Stratix III E
Logic Elements (LEs) 107,500 —
Embedded Memory Bits 8,936,448 —
Logic Array Blocks (LABs) 4,300 —
User I/Os 488 —
Paket 780-ball FCBGA (Flip-Chip BGA) —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm
Maximum Operating Frequency 500 MHz —
DSP Blocks Yes (integrated, count varies by configuration) —
Transceiver Channels 8 (multi-gigabit) —
Embedded Memory TriMatrix (MLAB + M9K + M144K) —
Configuration Method Serial / Parallel via Quartus II —
Operating Temperature Grade Commercial (C suffix) —
Status RoHS Compliant unknown
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating] —
Logic Elements — 107500
Number of LABs/CLBs — 4300
Number of Logic Elements/Cells — 107500
Total RAM Bits — 8936448
Number of I/O — 488
Voltage - Supply — 1.1 V core
Suhu Kerja — -40C to +100C (industrial)
Paket / Case — 780-BBGA, FCBGA (FineLine BGA)
Supplier Device Package — 780-FBGA
Tingkat Sensitivitas Kekeringan (MSL) — unknown
Grade — Industrial

Spek dan Sumber

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