EP3SE110F780C3N vs EP3SE110F780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C3N sa pamamagitan ng Intel at EP3SE110F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F780C3N EP3SE110F780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Stratix III E Stratix III E
Logic Elements (LEs) 107,500 —
Embedded Memory Bits 8,936,448 —
Logic Array Blocks (LABs) 4,300 —
User I/Os 488 —
Packhaging 780-ball FCBGA (Flip-Chip BGA) —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm
Maximum Operating Frequency 500 MHz —
DSP Blocks Yes (integrated, count varies by configuration) —
Transceiver Channels 8 (multi-gigabit) —
Embedded Memory TriMatrix (MLAB + M9K + M144K) —
Configuration Method Serial / Parallel via Quartus II —
Operating Temperature Grade Commercial (C suffix) —
Tindminan RoHS Compliant unknown
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] —
Logic Elements — 107500
Number of LABs/CLBs — 4300
Number of Logic Elements/Cells — 107500
Total RAM Bits — 8936448
Number of I/O — 488
Voltage - Supply — 1.1 V core
Temperature na Operasyon — -40C to +100C (industrial)
Packhaging / Kaso — 780-BBGA, FCBGA (FineLine BGA)
Supplier Device Package — 780-FBGA
Level ng Sensitivity sa Asid ng Moisture (MSL) — unknown
Grade — Industrial

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