EP3SE110F780C4LN vs EP3SE110F780C3N Perbandingan
Perbandingan bersamaan detil EP3SE110F780C4LN dari Intel dan EP3SE110F780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F780C4LN | EP3SE110F780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/O Pins | 488 | — |
| Paket | 780-BBGA, FCBGA (Fine-pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| Supply Voltage Core | 0.9 V (typical) | — |
| Suhu Kerja | 0C to +85C (Commercial) | — |
| Speed Grade | C4 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Tipe Mounting | Surface Mount (SMT) | Surface Mount (BGA) |
| Process Technology | 40 nm TSMC | 65 nm |
| DSP Blocks | Yes (18x18 multipliers) | Yes (integrated, count varies by configuration) |
| Level MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Tray Packaging | Yes (per distributor listings) | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Status RoHS | — | Compliant |