EP3SE110F780C4LN vs EP3SE110F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C4LN sa pamamagitan ng Intel at EP3SE110F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780C4LN | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/O Pins | 488 | — |
| Packhaging | 780-BBGA, FCBGA (Fine-pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| Supply Voltage Core | 0.9 V (typical) | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Speed Grade | C4 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (SMT) | Surface Mount (BGA) |
| Process Technology | 40 nm TSMC | 65 nm |
| DSP Blocks | Yes (18x18 multipliers) | Yes (integrated, count varies by configuration) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Tray Packaging | Yes (per distributor listings) | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Tindminan RoHS | — | Compliant |