EP3SE110F780C4LN vs EP3SE110F780C3N 比較
詳細並排比較 EP3SE110F780C4LN 由 Intel 與 EP3SE110F780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F780C4LN | EP3SE110F780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/O Pins | 488 | — |
| 封裝 | 780-BBGA, FCBGA (Fine-pitch) | 780-ball FCBGA (Flip-Chip BGA) |
| Supply Voltage Core | 0.9 V (typical) | — |
| 工作溫度 | 0C to +85C (Commercial) | — |
| Speed Grade | C4 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| 安裝類型 | Surface Mount (SMT) | Surface Mount (BGA) |
| Process Technology | 40 nm TSMC | 65 nm |
| DSP Blocks | Yes (18x18 multipliers) | Yes (integrated, count varies by configuration) |
| MSL 等級 | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Tray Packaging | Yes (per distributor listings) | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| RoHS 狀態 | — | Compliant |