EP3SE260F1152C4N vs EP3SE260F1152C4LN Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152C4LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C4N | EP3SE260F1152C4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Series | Stratix III E | — |
| Family | Stratix III (Enhanced) | Stratix III E |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Operating Frequency | 450 MHz | — |
| Paket | 1152-ball FC-FBGA (flip-chip) | 1152-ball FC-BGA |
| Speed Grade | -4 (commercial temperature) | C4 |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Tipe Memori | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 744 |
| Core Clock Speed | — | 375 MHz (max) |
| Transceiver Data Rate | — | 717 MHz |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Status RoHS | — | Compliant |