EP3SE260F1152I3G vs EP3SE260F1152I3 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152I3G dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152I3G EP3SE260F1152I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series Stratix III E Stratix III E (EP3SE260)
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits —
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 744
Paket 1152-BBGA, FCBGA (FineLine BGA) 1152-BBGA, FC-FBGA (Flip-Chip)
Rentang Suhu Kerja -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) I3 (Industrial, speed bin 3)
Process Technology 40 nm TSMC low-power 65 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: RoHS compliance not stated in scraped data] [DATA_NEEDED: RoHS status]
Tingkat Sensitivitas Kekeringan (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements — 255,000
Number of LABs/CLBs — 10,200
Total RAM Bits — 16,672,768
Number of Embedded Multipliers (DSP blocks) — 768
Core Voltage — 1.1 V
Suhu Kerja — -40C to +100C (Industrial)
Maximum Fabric Frequency — 500 MHz
Level MSL — [DATA_NEEDED: MSL level]
Product Status — Obsolete (per Xecor comparator)

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon