EP3SE260F1152I3G vs EP3SE260F1152I3 مقایسه
مقایسه دقیق کنار به کنار EP3SE260F1152I3G توسط Intel و EP3SE260F1152I3 توسط Intel. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
مقایسه مشخصات
| پارامتر | EP3SE260F1152I3G | EP3SE260F1152I3 |
|---|---|---|
| برند | Intel | Intel |
| دسته‌بندی | FPGA & CPLD | FPGA & CPLD |
| وضعیت چرخه عمر | NRND | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | 744 |
| بسته‌بندی | 1152-BBGA, FCBGA (FineLine BGA) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| محدوده دمای کاری | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | I3 (Industrial, speed bin 3) |
| Process Technology | 40 nm TSMC low-power | 65 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| نوع نصب | Surface Mount (BGA) | Surface Mount |
| وضعیت RoHS | [DATA_NEEDED: RoHS compliance not stated in scraped data] | [DATA_NEEDED: RoHS status] |
| سطح حساسیت به رطوبت (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Core Voltage | — | 1.1 V |
| دمای کاری | — | -40C to +100C (Industrial) |
| Maximum Fabric Frequency | — | 500 MHz |
| سطح MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |