EP3SE260F1152I4N vs EP3SE260F1152I3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I4N dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I4N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | — |
| Core Voltage | 0.86 V | 1.1 V |
| Process Technology | TSMC 40 nm | 65 nm |
| Paket | 1152-ball FCBGA (35 mm x 35 mm) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 4 | I3 (Industrial, speed bin 3) |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Product Status | — | Obsolete (per Xecor comparator) |