EP3SE260F1152I4N vs EP3SE260F1152I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I4N sa pamamagitan ng Intel at EP3SE260F1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152I4N | EP3SE260F1152I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | — |
| Core Voltage | 0.86 V | 1.1 V |
| Process Technology | TSMC 40 nm | 65 nm |
| Packhaging | 1152-ball FCBGA (35 mm x 35 mm) | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 4 | I3 (Industrial, speed bin 3) |
| Level ng MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Product Status | — | Obsolete (per Xecor comparator) |