EP3SE260F1517C3 vs EP3SE260F1517C3N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C3 dari Intel dan EP3SE260F1517C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C3 | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits (16.7 Mbits) |
| User I/Os | 976 | 976 |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | 4 |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| Paket | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA (FCBGA) |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C3 (commercial) |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III E |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Suhu Hubung Kerja | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |