EP3SE260F1517C3 vs EP3SE260F1517C4LN Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C3 dari Intel dan EP3SE260F1517C4LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C3 | EP3SE260F1517C4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| Paket | 1517-BBGA, FCBGA (FineLine BGA) | — |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C4 |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (flip-chip) |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III E (Enhanced) |
| Number of LABs/CLBs | — | 10,200 |
| Total Memory Bits | — | 16,672,768 (16.67 Mbit) |
| Number of I/O | — | 976 |
| Number of Gates | — | [DATA_NEEDED: gate count not published in web data] |
| Voltage - Supply | — | 0.9 V to 1.1 V core |
| Operating Frequency | — | 375 MHz to 450 MHz (per family) |
| Process Technology | — | 65 nm |
| Paket / Case | — | 1517-BBGA, FCBGA (FC-FBGA) |
| Suhu Kerja | — | 0C to +85C (commercial grade per 'C' suffix) |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Lead-Free / Halogen-Free | — | Yes (LN suffix) |