EP3SE260F1517C3 vs EP3SE260F1517C4LN 比較

詳細並排比較 EP3SE260F1517C3 由 Intel 與 EP3SE260F1517C4LN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C3 EP3SE260F1517C4LN
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 最後購買
Manufacturer Intel (formerly Altera) —
Series Stratix III E Stratix III E
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 976 —
DSP Blocks (18x18 multipliers) 768 —
PLLs 12 —
Core Voltage 0.9 V —
Process Node 65 nm (TSMC) —
封裝 1517-BBGA, FCBGA (FineLine BGA) —
Package Pitch 1.0 mm —
Operating Temperature Grade Commercial (C suffix) —
Speed Grade 3 C4
Configuration SRAM-based, requires external configuration device —
安裝類型 Surface Mount (BGA) Surface Mount (flip-chip)
RoHS 狀態 Compliant Compliant
Family — Stratix III E (Enhanced)
Number of LABs/CLBs — 10,200
Total Memory Bits — 16,672,768 (16.67 Mbit)
Number of I/O — 976
Number of Gates — [DATA_NEEDED: gate count not published in web data]
Voltage - Supply — 0.9 V to 1.1 V core
Operating Frequency — 375 MHz to 450 MHz (per family)
Process Technology — 65 nm
封裝 / 外殼 — 1517-BBGA, FCBGA (FC-FBGA)
工作溫度 — 0C to +85C (commercial grade per 'C' suffix)
濕度敏感等級 (MSL) — 3 (168 Hours)
Packaging — Tray
Lead-Free / Halogen-Free — Yes (LN suffix)

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