EP3SE260F1517C3 vs EP3SE260F1517C4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C3 disebabkan oleh Intel dan EP3SE260F1517C4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C3 | EP3SE260F1517C4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| Kemasan | 1517-BBGA, FCBGA (FineLine BGA) | — |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C4 |
| Configuration | SRAM-based, requires external configuration device | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip) |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III E (Enhanced) |
| Number of LABs/CLBs | — | 10,200 |
| Total Memory Bits | — | 16,672,768 (16.67 Mbit) |
| Number of I/O | — | 976 |
| Number of Gates | — | [DATA_NEEDED: gate count not published in web data] |
| Voltage - Supply | — | 0.9 V to 1.1 V core |
| Operating Frequency | — | 375 MHz to 450 MHz (per family) |
| Process Technology | — | 65 nm |
| Kemasan / Case | — | 1517-BBGA, FCBGA (FC-FBGA) |
| Suhu Operasi | — | 0C to +85C (commercial grade per 'C' suffix) |
| Tingkat sensitiviti Air Nama (MSL) | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Lead-Free / Halogen-Free | — | Yes (LN suffix) |