EP3SE260F1517C3N vs EP3SE260F1517C2N Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C3N dari Intel dan EP3SE260F1517C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C3N | EP3SE260F1517C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Paket | 1517-BBGA (FCBGA) | 1517-ball FC-BGA |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Speed Grade | C3 (commercial) | C2 |
| Suhu Hubung Kerja | 0 C to +85 C (commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| Total Memory Bits | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Core Voltage | — | 1.1 V |
| Maximum Core Frequency | — | 600 MHz |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Interface | — | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | — | Yes |