EP3SE260F1517C3N vs EP3SE260F1517C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3N sa pamamagitan ng Intel at EP3SE260F1517C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3N | EP3SE260F1517C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Packhaging | 1517-BBGA (FCBGA) | 1517-ball FC-BGA |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Speed Grade | C3 (commercial) | C2 |
| Temperature ng Junction na Operasyon | 0 C to +85 C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| Total Memory Bits | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Core Voltage | — | 1.1 V |
| Maximum Core Frequency | — | 600 MHz |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Interface | — | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | — | Yes |