EP3SE260F1517C4LN vs EP3SE260F1517C2 Perbandingan
Perbandingan bersamaan detil EP3SE260F1517C4LN dari Intel dan EP3SE260F1517C2 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Waktu Beli TerakhirAltera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517C4LN | EP3SE260F1517C2 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Series | Stratix III E | Stratix® III E |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | 16,672,768 |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | — |
| Paket / Case | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Tipe Mounting | Surface Mount (flip-chip) | Surface Mount |
| Suhu Kerja | 0C to +85C (commercial grade per 'C' suffix) | — |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | C2 |
| Lead-Free / Halogen-Free | Yes (LN suffix) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Logic Elements (LE) | — | 254,400 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Distributed RAM (Kb) | — | 4,608 |
| Embedded Block RAM (Kb) | — | 15,408 |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Pins | — | 976 |
| High-Speed Transceivers | — | 48 (up to 6.375 Gbps) |
| PLLs | — | 12 |
| Temperature Grade | — | Commercial (0C to +85C, suffix C2) |
| Paket | — | 1517-BBGA, FCBGA |
| Process Node | — | TSMC 40 nm |