EP3SE260F1517C4LN vs EP3SE260F1517C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4LN sa pamamagitan ng Intel at EP3SE260F1517C2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1517C4LN EP3SE260F1517C2
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Series Stratix III E Stratix® III E
Family Stratix III E (Enhanced) —
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) 16,672,768
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
Packhaging / Kaso 1517-BBGA, FCBGA (FC-FBGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount
Temperature na Operasyon 0C to +85C (commercial grade per 'C' suffix) —
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 C2
Lead-Free / Halogen-Free Yes (LN suffix) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS compliance]
Logic Elements (LE) — 254,400
Logic Array Blocks (LAB) — 10,200
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Distributed RAM (Kb) — 4,608
Embedded Block RAM (Kb) — 15,408
Embedded Multipliers (18x18) — 384
User I/O Pins — 976
High-Speed Transceivers — 48 (up to 6.375 Gbps)
PLLs — 12
Temperature Grade — Commercial (0C to +85C, suffix C2)
Packhaging — 1517-BBGA, FCBGA
Process Node — TSMC 40 nm

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