EP3SE260F1517I4N vs EP3SE260F1517I4L Perbandingan

Perbandingan bersamaan detil EP3SE260F1517I4N dari Intel dan EP3SE260F1517I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1517I4N EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1517I4N EP3SE260F1517I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Aktif
Series Stratix III E Stratix III
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits —
Embedded Memory (M9K/M144K blocks) [DATA_NEEDED: total Kbits and block count] —
User I/O Pins 976 —
Transceivers [DATA_NEEDED: number of full-duplex channels] —
Transceiver Data Rate 600 Mbps to 6.375 Gbps —
DSP Blocks [DATA_NEEDED: number of 18x18 multipliers] —
PLLs [DATA_NEEDED: total PLL count] —
Core Voltage 1.1 V —
Process Technology TSMC 65 nm 65 nm CMOS
Paket 1517-BBGA, FCBGA —
Package Body Size [DATA_NEEDED: mm x mm] —
Suhu Kerja -40 °C to +100 °C (Industrial) -40C to +100C (Industrial)
Operating Temperature Grade Industrial (I4) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS statement] Yes (L suffix)
Level MSL [DATA_NEEDED: MSL classification] 3 (per JEDEC J-STD-020)
Family — Stratix III Enhanced (E)
Embedded Memory — 16,672,768 bits (16.6 Mbits)
Maximum User I/O — 976
Package Type — 1517-BBGA, FCBGA
Package Dimensions — 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch)
Temperature Grade — Industrial
Speed Grade — I4
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
DSP Blocks (18x18 Multipliers) — 768
Configuration Method — JTAG, Passive Serial, Fast Passive Parallel
Status RoHS — Compliant

Spek dan Sumber

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