EP3SE260F1517I4N vs EP3SE260F1517I4L 比較
詳細並排比較 EP3SE260F1517I4N 由 Intel 與 EP3SE260F1517I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517I4N | EP3SE260F1517I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Series | Stratix III E | Stratix III |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm CMOS |
| 封裝 | 1517-BBGA, FCBGA | — |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 工作溫度 | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Operating Temperature Grade | Industrial (I4) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | Yes (L suffix) |
| MSL 等級 | [DATA_NEEDED: MSL classification] | 3 (per JEDEC J-STD-020) |
| Family | — | Stratix III Enhanced (E) |
| Embedded Memory | — | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Temperature Grade | — | Industrial |
| Speed Grade | — | I4 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS 狀態 | — | Compliant |