EP3SE260H780I4 vs EP3SE260H780C4N Perbandingan
Perbandingan bersamaan detil EP3SE260H780I4 dari Intel dan EP3SE260H780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780I4 | EP3SE260H780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Paket | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (Flip Chip BGA) |
| Suhu Kerja | -40C to +100C (industrial, 'I' grade) | 0C to +85C (commercial) |
| Speed Grade | 4 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 (168 hours) |
| Configuration Method | — | Serial/Parallel via Quartus II |