EP3SE260H780I4LG vs EP3SE260H780C4LG Perbandingan

Perbandingan bersamaan detil EP3SE260H780I4LG dari Intel dan EP3SE260H780C4LG dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780I4LG EP3SE260H780C4LG
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Series Stratix III Enhanced —
Family EP3SE260 Stratix III Enhanced (EP3SE)
Logic Elements 255,000 LE 254,400
Adaptive Logic Modules (ALMs) 102,000 ALM 101,760
Embedded Memory 15.90 Mbit —
DSP Blocks 304 —
18x18 Multipliers 840 —
User I/O 488 —
PLLs 8 (4 fractional + 4 general-purpose) —
Speed Grade -4 C4 (commercial, mid-speed tier)
Temperature Grade Industrial (I) Commercial (0C to +85C junction)
Paket 780-ball FineLine BGA (HBGA) 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch)
Suhu Kerja -40C to +100C —
Process Technology 65 nm low-power CMOS 65 nm TSMC low-power CMOS
Configuration Method JTAG / Passive Serial / Fast Passive Parallel / Active Serial —
Embedded Memory (M9K + M144K) — 18.36 Mbits
DSP Blocks (18-bit x 18-bit) — 768
18-bit x 18-bit Multipliers — 1,536
Transceivers (full-duplex) — 8 (up to 6.375 Gbps)
Maximum User I/O Pins — 488
Operating Voltage (Core) — 0.9 V / 1.0 V / 1.1 V (programmable)
External Memory Interface — Up to 800 Mbps DDR3, QDR II+, RLDRAM II
Hard IP Blocks — PCIe Gen2, 10GbE MAC, memory controllers
Status RoHS — Compliant (Pb-free HBGA)
Level MSL — 3 (per JEDEC J-STD-020)
Tipe Mounting — Surface Mount (BGA)

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