EP3SE260H780I4LG vs EP3SE260H780C4LG 比較

詳細並排比較 EP3SE260H780I4LG 由 Intel 與 EP3SE260H780C4LG 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260H780I4LG EP3SE260H780C4LG
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Series Stratix III Enhanced —
Family EP3SE260 Stratix III Enhanced (EP3SE)
Logic Elements 255,000 LE 254,400
Adaptive Logic Modules (ALMs) 102,000 ALM 101,760
Embedded Memory 15.90 Mbit —
DSP Blocks 304 —
18x18 Multipliers 840 —
User I/O 488 —
PLLs 8 (4 fractional + 4 general-purpose) —
Speed Grade -4 C4 (commercial, mid-speed tier)
Temperature Grade Industrial (I) Commercial (0C to +85C junction)
封裝 780-ball FineLine BGA (HBGA) 780-ball FineLine BGA (HBGA, 29 mm x 29 mm, 1.0 mm pitch)
工作溫度 -40C to +100C —
Process Technology 65 nm low-power CMOS 65 nm TSMC low-power CMOS
Configuration Method JTAG / Passive Serial / Fast Passive Parallel / Active Serial —
Embedded Memory (M9K + M144K) — 18.36 Mbits
DSP Blocks (18-bit x 18-bit) — 768
18-bit x 18-bit Multipliers — 1,536
Transceivers (full-duplex) — 8 (up to 6.375 Gbps)
Maximum User I/O Pins — 488
Operating Voltage (Core) — 0.9 V / 1.0 V / 1.1 V (programmable)
External Memory Interface — Up to 800 Mbps DDR3, QDR II+, RLDRAM II
Hard IP Blocks — PCIe Gen2, 10GbE MAC, memory controllers
RoHS 狀態 — Compliant (Pb-free HBGA)
MSL 等級 — 3 (per JEDEC J-STD-020)
安裝類型 — Surface Mount (BGA)

資料表與資源

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