EP3SE50F484C2G vs EP3SL50F484C2N Perbandingan
Perbandingan bersamaan detil EP3SE50F484C2G dari Intel dan EP3SL50F484C2N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
EP3SE50F484C2G ⚠ Waktu Beli TerakhirAltera
EP3SL50F484C2N - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
EP3SL50F484C2N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE50F484C2G | EP3SL50F484C2N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Series | Stratix III E | Stratix III L |
| Number of Logic Elements / Cells | 47,500 | — |
| Number of LABs / CLBs | 1,900 | — |
| Total RAM Bits | 5,760,000 (5,760 Kbit) | — |
| Number of User I/O | 296 | — |
| Paket / Case | 484-BBGA, FCBGA (FineLine BGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Core Voltage Supply | 0.86 V to 1.15 V | — |
| Suhu Kerja | 0 °C to +85 °C (TJ) | — |
| Process Technology | 40 nm TSMC low-power CMOS | 65 nm |
| Logic Element Architecture | Adaptive Logic Module (ALM) with 8-input fracturable LUT | — |
| Embedded DSP Blocks | Yes (variable-precision multipliers) | — |
| Transceivers | Multi-gigabit transceivers (selected package pins) | — |
| Memory Interface Support | DDR / DDR2 / DDR3 with hard PHY | — |
| Partial Reconfiguration | Supported | — |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel | — |
| Part Status | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy | — |
| Status RoHS | Compliant | — |
| Family | — | Stratix III |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory | — | 2,184,192 bits |
| User I/Os | — | 296 |
| Operating Frequency | — | 600 MHz |
| Core Supply Voltage | — | 1.1 V |
| Paket | — | 484-ball FC-FBGA (Flip-Chip) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial (C2) |
| Lead-Free / RoHS | — | Yes (compliant) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Method | — | JTAG / Passive Serial / FPP |