EP3SE50F484I3 vs EP3SE50F484C3N Perbandingan
Perbandingan bersamaan detil EP3SE50F484I3 dari Intel dan EP3SE50F484C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F484I3 | EP3SE50F484C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits | — |
| User I/Os | 296 | 296 |
| Process Technology | 65 nm | TSMC 40 nm low-power CMOS |
| Core Voltage | 1.1 V | — |
| Paket | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Lead-free (per DigiKey listing) |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 47,500 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Tegangan Pemuat | — | Core and I/O voltages per Stratix III E datasheet |
| Suhu Kerja | — | 0C to +85 C (commercial, C suffix) |
| Level MSL | — | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Status Lingkungan Hidup | — | Obsolete (per Worldway listing 2026-04-05) |