EP3SE50F780C2G vs EP3SE50F780C4N Perbandingan

Perbandingan bersamaan detil EP3SE50F780C2G dari Intel dan EP3SE50F780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE50F780C2G EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA

EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA

EP3SE50F780C2G ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE50F780C2G EP3SE50F780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Series Stratix III E —
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Logic Array Blocks (LABs) 1,900 LAB —
Embedded Memory 5.49 Mbit —
Maximum User I/Os 488 I/O 488
Number of Pins/Terminals 780 —
Paket 780-BBGA, FCBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Process Technology 65 nm —
Core Supply Voltage 1.1 V —
Minimum Supply Voltage 0.86 V —
Speed Grade C2 (commercial, moderate speed) —
Suhu Kerja 0C to +85C 0C to +85C (C4 commercial grade)
Gaya Mounting SMD/SMT —
Embedded Multipliers (18x18) 132 —
Family — Stratix III E
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Tipe Mounting — Surface Mount (BGA)
Tegangan Pemuat — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
Status RoHS — Lead-free / RoHS compliant
Level MSL — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

Spek dan Sumber

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