EP3SE50F780C3N vs EP3SE50F780C4L Perbandingan
Perbandingan bersamaan detil EP3SE50F780C3N dari Intel dan EP3SE50F780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C3N | EP3SE50F780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (M9K blocks) | 312 | — |
| Total Embedded Memory | 5,760 Kbit (5.76 Mbit) | — |
| DSP Blocks | 432 | — |
| Maximum User I/Os | 488 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C3 (medium) | C4 (commercial, speed 4) |
| Temperature Grade | Commercial (0C to +85C) | — |
| Paket | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Tipe Mounting | Surface Mount | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Suhu Kerja | — | [DATA_NEEDED: full industrial/commercial grade] |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |