EP3SE50F780C3N vs EP3SE50F780C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780C3N disebabkan oleh Intel dan EP3SE50F780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F780C3N | EP3SE50F780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (M9K blocks) | 312 | — |
| Total Embedded Memory | 5,760 Kbit (5.76 Mbit) | — |
| DSP Blocks | 432 | — |
| Maximum User I/Os | 488 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C3 (medium) | C4 (commercial, speed 4) |
| Temperature Grade | Commercial (0C to +85C) | — |
| Kemasan | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Suhu Operasi | — | [DATA_NEEDED: full industrial/commercial grade] |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |