EP3SE50F780C3N vs EP3SE50F780C4L 比較
詳細並排比較 EP3SE50F780C3N 由 Intel 與 EP3SE50F780C4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE50F780C3N | EP3SE50F780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (M9K blocks) | 312 | — |
| Total Embedded Memory | 5,760 Kbit (5.76 Mbit) | — |
| DSP Blocks | 432 | — |
| Maximum User I/Os | 488 | — |
| Number of PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C3 (medium) | C4 (commercial, speed 4) |
| Temperature Grade | Commercial (0C to +85C) | — |
| 封裝 | 780-ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| 安裝類型 | Surface Mount | — |
| RoHS 狀態 | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| 工作溫度 | — | [DATA_NEEDED: full industrial/commercial grade] |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |