EP3SE50F780C4G vs EP3SE50F780C4N Perbandingan

Perbandingan bersamaan detil EP3SE50F780C4G dari Intel dan EP3SE50F780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE50F780C4G EP3SE50F780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Family Stratix III E Stratix III E
Series Stratix III —
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 5.76 Mbit (5760000 bit) —
Number of I/Os 488 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: LAB count from datasheet] —
Number of Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] —
Process Technology 40 nm TSMC —
Core Supply Voltage 1.1 V —
Rentang Suhu Kerja 0 C to +85 C (commercial) —
Paket 780-ball FBGA (FCBGA) 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Tipe Mounting Surface Mount (SMD/SMT) Surface Mount (BGA)
Status RoHS Compliant Lead-free / RoHS compliant
Lead-Free Yes —
Level MSL MSL3 (per JEDEC J-STD-020) 3 (per JEDEC J-STD-020, FBGA package)
Configuration Memory SRAM-based (volatile, requires configuration device) —
Design Software Quartus II —
Logic Elements (LE) — 47,500
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
DSP Blocks (18x18 multipliers) — 432
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Tegangan Pemuat — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Suhu Kerja — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

Spek dan Sumber

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