EP3SE80F1152I4N vs EP3SE80F1152I3N Perbandingan
Perbandingan bersamaan detil EP3SE80F1152I4N dari Intel dan EP3SE80F1152I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Waktu Beli TerakhirIntel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE80F1152I4N | EP3SE80F1152I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Series | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Embedded Memory Bits | 6,843,392 bits | 6,843,392 |
| User I/O Count | 744 | — |
| Paket | 1152-BBGA, FCBGA (flip-chip) | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Internal Frequency | 450 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | I4 | I3 |
| Tipe Memori | SRAM-based configuration | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III E |
| Logic Array Blocks (LABs) | — | 3,200 |
| Maximum User I/O | — | 744 |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Suhu Kerja | — | -40 °C to +100 °C (Industrial) |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |