EP3SE80F1152I4N vs EP3SE80F1152I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F1152I4N disebabkan oleh Intel dan EP3SE80F1152I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Bahagian terakhir untuk beliIntel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE80F1152I4N | EP3SE80F1152I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Embedded Memory Bits | 6,843,392 bits | 6,843,392 |
| User I/O Count | 744 | — |
| Kemasan | 1152-BBGA, FCBGA (flip-chip) | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Internal Frequency | 450 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | I4 | I3 |
| Jenis Ingatan | SRAM-based configuration | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III E |
| Logic Array Blocks (LABs) | — | 3,200 |
| Maximum User I/O | — | 744 |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Suhu Operasi | — | -40 °C to +100 °C (Industrial) |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |