EP3SE80F780C2 vs EP3SE50F780C2 Perbandingan

Perbandingan bersamaan detil EP3SE80F780C2 dari Intel dan EP3SE50F780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE80F780C2 EP3SE50F780C2
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Logic Elements 80,000 —
Embedded Memory Bits 6,843,392 bits —
User I/Os 488 —
Logic Array Blocks (LABs) 3,200 —
DSP Blocks 320 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Maximum Core Clock 600 MHz —
Paket 780-Ball FC-FBGA (Flip-Chip BGA) 780-BBGA, FC-FBGA
Tipe Mounting Surface Mount Surface Mount
Configuration Mode Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) —
Operating Temperature Grade Commercial (0C to +85C) Commercial (C2)
Status RoHS Compliant [DATA_NEEDED: current RoHS status]
Lead-Free Yes —
Number of PLLs 12 —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X —
Manufacturer — Intel (formerly Altera)
Logic Elements (LE) — 47,500
LABs / CLBs — 1,900
Total Memory Bits — 5,760,000
User I/O Count — 488
DSP Blocks (18x18 multipliers) — 384
Operating Frequency — Up to 600 MHz
Number of Pins / Terminals — 780
Form of Terminal — Ball
Package Code — BGA

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